Toronto, Ontario — July 23, 2018 — TECNA has designed and developed a new patented technology that uses infrared heating to simplify the removal of adhesives. Designed to make no-contact adhesive removal fast and easy, the system uses localized heating of the adhesive allowing for simple detatchment.
Water-cooled for temperature control, the invisible rays do not create an electromagnetic field, the company says, adding that it can be safely used on adhesives bonded to steel, aluminum, carbon and plastics. The system also comes equiped with a USB-connectable interface with a touchscreen display allowing the operator to set the perameters of the system’s use and allowing it to recieve de-bonding software upgrades.
